SMTA (Hong Kong) Chapter
SMTA華東高科技技術工作坊 2017
SMTA China East Technology Workshop 2017
SMTA華東高科技技術工作坊 2017
舉行日期:2017年4月24日
舉行地點:上海世博展覽館地下二層6 號會議室
參加費用:人民幣1250元(包含發票)
所有參加者將可獲得1)中國SMTA技術工作坊證書 2)課程資料(不提供午餐和住宿)
查詢及報名:電郵至 peggychen@smta.org.cn , 電話:+86-21-56093010

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SMTA China East Technology Workshop 2017
Event date : 24th April 2017
Venue : Room No.6, B2, Shanghai World Expo Exhibition & Convention Center
Registration Fee : RMB1250 (including offical invoice)
All Registrant will received : 1)SMTA China Technology Workshop Certificate, 2)Course Information (Lunch and accommodation not included)
For registration, please contact peggychen@smta.org.cn , Tel : +86-21-56093010

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(Click here to download the details)



課程議題:PCBA失效分析方法及其典型的案例研究

課程背景

電子資訊時代,當我們持續不斷地改進電子產品的功能及應用範圍以滿足人們生活高需求時,產品的設計也變得越來越複雜:高密度集成PCB(HDI)越來越普遍,元器件引腳間距越來越小、排布也越來越密集等等。這些因素要求生產廠商必須擁有先進的生產設備與工藝技術、高品質的生產環境與物料。在先進設備引進與先進工藝開發過程中,我們無法避免地會遇到大量的PCBA失效問題,這就需要系統的失效分析理論來分析解決問題。在電子產品中,失效是指不能執行或提供其預期功能或輸出的設備或系統的一種狀態。用戶端產品出現的失效將會對製造方產生極度不好的影響,這些影響包括客戶對產品的不滿意或者資產損失甚至生命危險等更為嚴重的安全性問題。因此,找出產品的失效原因是十分重要的,失效原因分析將幫助我們去解決問題並防止它再次發生。

課程摘要和收穫

在本次課程中,我們將利用先進、專業、高效的分析技術與十多年的實戰經驗,結合先進工藝技術理論與經驗,通過對實際案例進行剖析,並對有關PCBA的失效分析理論系統地進行深入的探討。如斷口分析、微觀結構與成分分析、切片金相分析,化學腐蝕、電化學遷移(ECM)和微形變分析等。相關的內容包括怎樣去開展你的失效分析,可以應用到的一些方法,怎樣去幫助我們找到失效的根源,什麼時候去使用這些技巧以及一些我們曾經成功的失效分析案例。

目標群體

從事失效分析的人員: 失效分析工程師,工藝工程師,品質工程師,可靠性工程師,設計人員和相關的管理層人員等。

本課程將會覆蓋到以下內容:

I. PCBA失效分析概述

1. 概述
2. 術語與標準
3. 失效分析原理
4. 失效分析的基本程式
5. 典型失效模式

II. 典型的PCBA失效分析方法概述

1. X-Ray檢測技術
2. 金相切片分析技術
3. 染色試驗技術
4. 掃描電鏡分析技術
5. 能譜分析方法
6. 紅外顯微鏡分析技術
7. 離子色譜分析技術
8. 應力測量分析技術
9. 其它分析方法

III. 失效分析技術的應用及其案例分析

1. 物料缺陷相關的失效分析案例

1.1 PCB相關的缺陷
1.2 典型的焊接工藝缺陷案例分析
1.3 元器件相關的缺陷
1.4 腐蝕案例分析
1.5 表面處理和焊點完整性

2. 生產工藝缺陷失效案例

2.1 回流焊相關缺陷
2.2 波峰焊相關缺陷
2.3 返工相關缺陷

3. 離子污染物殘留相關失效案例

3.1 元器件分析
3.2 組裝中使用的化學品分析
3.3 電化學遷移的枝狀晶體失效案例

4. 機械應力相關的失效案例

4.1 回流焊工藝引起的失效
4.2 電測引起的失效
4.3 機械組裝的相關失效
4.4 運輸引起的相關失效

5. 其它失效分析方法的應用

5.1 ACF導電膠膜固化率分析
5.2 表面污染物分析
5.3 阻燃劑中磷元素的分析
5.4 陶瓷電容器切片分析中的黃染料技術


Course Title : PCBA FA METHODOLOGIES AND TYPICAL CASE STUDIES

Course Background

The continuous research to improve product functionality and application has led electronic product to have more and more complicated design like high PCB layer counts, finer component pin pitch, densely populated board, and so on that requires advance manufacturing machines, process, environment and raw materials. But even with all these “advance” manufacturing controls and setup, we cannot avoid to have some failures that need systematic approach of analysis together with the use of sets of FA methodologies. And product failure at end customer side has a devastating effect ranging from customer dissatisfaction to a more serious problem such as safety issues that may cause loss of asset or even lives. With this, determining the root cause (s) is very important.

Course Summary and Benefits

In electronic product, failure is the state of an apparatus or system in which it cannot perform or give its intended function or output. In order to determine the cause of its failure the failure analysis engineer needs to implement the process of collecting and analysing data by using a wide array of methods. Once failure root cause is detected, it will help us fix the problem at its source and prevent it from occurring again. With our highly experienced and are experts in fields, in this presentation, we will be discussing some of the PCBA FA methodologies liked physical fracture / grain / microstructural analysis, compositional / phase diagram analysis of mixed-up alloy, corrosion/ dendrite analysis, microdeformation (µε) analysis, some tips on how to start your FA, what methodologies are applicable, how it can help to find the root cause, when to use it, and some of the actual case samples that we successfully identified for the root cause.

Target Audience

Personnel engaged in failure analysis - FA engineers, process engineers, quality engineers, reliability engineers, designers and management personnel.

This course will cover the following topics

I. Introduction to PCBA Failure Analysis

1. Introduction
2. Terminologies and industry standards
3. Failure analysis principles
4. Basic FA procedure
5. Typical PCBA failure modes

II. Introduction to Typical PCBA FA Methodologies

1. X-Ray Analysis
2. Cross-section Analysis
3. Dye and Pry Analysis
4. Scanning Electron Microscopy (SEM)
5. Energy-dispersive X-ray spectroscopy (EDX)
6. Fourier Transform Infrared Spectroscopy (FTIR)
7. Ion Chromatography
8. Strain measurement analysis
9. Other techniques

III. Methodologies Applications and Case Analysis

1. Failure analysis cases due to Material Defects

1.1 Raw PCB related defectsv
1.2 Typical defects caused by Solder material
1.3 Component related defects
1.4 Corrosions cases analysis
1.5 PCB surface finishing and joint integrity

2. Failure analysis cases due to Manufacturing process defects

2.1 SMT related defects
2.2 Wave soldering related defects
2.3 Rework related defects

3. Failure analysis cases related to ionic contamination

3.1 Raw component analysis
3.2 Chemicals used in assemblies
3.3 Dendrite cases analysis

4. Failure analysis cases due to mechanical stress

4.1 SMT Assembly process induced defects
4.2 Board test process induced defects
4.3 Mechanical assembly related defects
4.4 Shipping and transport related defects

5. Other FA Methodologies Applications

5.1 PSA (ACF) cure percentage analysis
5.2 Surface contamination analysis
5.3 Plastic Fire Retardant P element evaluation
5.4 Fluorescence dye for CMC crack analysis


教師簡介

周輝
西北工業大學碩士
暨南大學工程管理碩士校外實踐導師
iNEMI亞洲執行委員會委員,
美國SMTA協會會員,
廣東電子學會SMT專委會專家

現任偉創力公司 亞洲區先進製造工程部總監/北中國區先進工程部總監/亞洲區先進工程部實驗室總監。從事新工藝技術的開發、新產品工藝開發及可製造性/可裝配性設計優化、DFX等方面的研究。有18年電子產品工藝開發、製造及品質控制經驗,曾在國際期刊上發表過20多篇技術論文, 內容涉及01005、 TMV PoP、0.3mm CSP等新工藝技術開發,HiP, NWO, Hot-bar等典型缺陷的解決方案以及公差累積分析與六西格瑪等方法論的實際應用等等。

Instructor Bio

Henley Zhou
The M.S. of Northwestern Poly-technical University,
The External Guider of MEM (Master of Engineering Management) in Jinan University
The member at association of American SMTA,
The member of the iNEMI Asia steering Committee,
The expert at the Committee of SMT Experts in Guangdong Institute of Electronics.

Currently he is the director of advanced manufacturing engineering dept., the director of North China Advanced Engineering Group, and also the director of AEG Labs-Asia in Flex. He is In charge of new manufacturing technology development & deployment, new product process development, value engineering analysis, yield improvement and failure analysis for any engineering escalation among different Asia sites. With 18 years’ work experience of process development, manufacturing, DFX, and quality control on electronics products, he has issued more than 20 technical papers on international publication for different technical topics such as 01005, TMV PoP, 0.3mm CSP, head-in-Pillow (HiP), Non Wet Open (NWO), high temperature hot-bar, tolerance stack-up analysis (TSA) and six sigma methodologies etc.

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